DuPont Electronics & Imaging offers a production-proven nickel plating chemistry that is ideal for under bump metallization (UBM). This product is formulated to meet the wide variety of customer needs for uniform deposits, excellent barrier capabilities, solderability, and other characteristics that are essential for consistent wafer fabrication.
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Under bump metallization – or UBM – is an advanced packaging process that involves creating a thin film metal layer stack between the integrated circuit (IC) or copper pillars and solder bumps in a flip chip package. Critical to package reliability, the stack serves 3 purposes:
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We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
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DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
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Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
View DetailsLook to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
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