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Production-Proven Nickel Plating Chemistry
DuPont Electronics & Imaging offers a production-proven nickel plating chemistry that is ideal for under bump metallization (UBM). This product is formulated to meet the wide variety of customer needs for uniform deposits, excellent barrier capabilities, solderability, and other characteristics that are essential for consistent wafer fabrication.
Products:
- Nikal BP Chemistry
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What is UBM?
Under bump metallization – or UBM – is an advanced packaging process that involves creating a thin film metal layer stack between the integrated circuit (IC) or copper pillars and solder bumps in a flip chip package. Critical to package reliability, the stack serves 3 purposes:
- It forms the electrical connection between the die and the bump
- It serves as a barrier to eliminate unwanted diffusion
- It creates the mechanical connection between the bump and the bump pad
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Our Semiconductor Packaging Portfolio
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Semiconductor Packaging Materials
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Under Bump Metallization
Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
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View DetailsHVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility. -
Copper Redistribution Layer
Copper Redistribution Layer
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
View Details -
Bump Plating Photoresists
Bump Plating Photoresists
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
View DetailsDuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating.