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Lithography Materials and Services
Market-leading Microlithography Materials to Support Advanced Patterning
DuPont designs microlithography materials to improve existing microlithography processes as well as support advanced patterning processes. Our long history in lithography technology includes many industry-first enabling technology innovations. We lead the market in terms of our breadth of offerings, including ArF photoresists, KrF photoresists, i/g line photoresists, and organic bottom anti-reflective coating (BARC) materials.
By collaborating with you to understand your technical challenges, we develop materials solutions to meet them. The more advanced the process, the more critical it is to work in partnership to design specific materials.
DuPont is here to support you with your biggest (and smallest) lithography challenges!
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What is Microlithography?
Microlithography, or photolithography, is an imaging technology that is critical to etch steps in semiconductor manufacturing. It is used to transfer circuitry patterns from a photomask to a silicon wafer, after which etch processes complete the pattern
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Enabling Next-Generation Computing
Driven by ubiquitous high-performance, low-power computing needs, the semiconductor manufacturing industry continues to shrink feature sizes to make faster and smaller transistors with higher storage acapacity. This requires high-quality and high-performing lithography materials.
Lithography Materials and Services
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Photoresists
Photoresists
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.
VIEW DETAILSPositive tone ArF (193 nm) dry photoresists optimized for trench and line/space applicationsPositive tone ArF (193 nm) dry photoresists optimized for trench and line/space applicationsPositive tone 193 nm immersion resists with an excellent process window, CD uniformity and low defectivityPositive tone 193 nm immersion resists with an excellent process window, CD uniformity and low defectivityPositive tone 193 nm implant resists with good profile through pitch and excellent substrate compatibilityPositive tone 193 nm implant resists with good profile through pitch and excellent substrate compatibility -
Advanced Overcoats
Advanced Overcoats
Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.
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Anti-Reflectants & Functional Sublayers
Anti-Reflectants & Functional Sublayers
Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.
VIEW DETAILSAR™ 10L is an organic, thermally cross-linking bottom anti-reflectant coating (BARC) for 248 nm (KrF) photoresists. It is designed to provide a universal anti-reflective surface for high- and low-temperature resist platforms and offers excellent compatibility with most ESCAP HYBRID and Acetal resists. AR™ 10L is a conformal 1st min., 248 nm anti-reflectant and is typically used in the range of 400-1200A over transparent thin films on reflective substrates.An organic, thermally cross-linking BARC for 248 nm photoresistsAn organic gap filling material for extremely narrow trenchesAn organic gap filling material for extremely narrow trenchesAn organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresistA family of cross-linkable BARCs that can etch 30% faster than photoresists -
Ancillary Lithography Materials
Ancillary Lithography Materials
DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.
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Electronic Grade Polymers
Electronic Grade Polymers
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.
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