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High-reliability Metallization for Fine-pitch PCB Designs
DuPont has long been a market leader in high-performance, high-reliability metallization for demanding PCB applications. As shrinking design guidelines and more challenging operating environments make metallization performance critical to the success of multilayer boards, DuPont is prepared to provide materials that allow you to meet your design goals.
We offer a wide variety of options for interlayer metallization, via fill, and final finishes tailored to substrate type and end application. Our materials support your metallization process every step of the way in applications including:
- IC substrates for advanced packages
- Challenging multi-layer PCB designs
- Flexible circuits with demanding configurations
- Next-generation high-density interconnect (HDI)
Choose DuPont as your materials solutions partner to:
- Enable even the most challenging PCB designs
- Ensure compliance with RoHS and REACH regulations
- Work with you to develop cost-effective metallization options that meet your needs
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What is PCB Metallization?
Both rigid and flexible PCBs contain multiple layers of interconnected metal lines. Trends toward device miniaturization and increased functionality are driving down line widths and spacings as well as via diameters. Metallization must be reliable and uniform regardless of surface topography.
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High-density, High-performing PCBs
Manufacturers of consumer electronics, automobiles, airplanes, 5G networks, and industrial equipment rely on high-density PCBs to keep their customers connected and safe. The metallization inside these PCBs has to be reliable no matter how fine the metal lines or how densely packed the design. Because of cost pressure, yields need to remain high. Choosing metallization products tailored to the type of substrate and the design density optimizes both yield and reliability.
Metallization Materials for PCBs
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View DetailsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityProviding uniform copper deposits by ensuring even absorbtion catalyst on dielectric materialsA high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceOffering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substratesProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageDesigned for use with periodic pulse reverse (PPR) platingDelivering high plating efficiency to improve productivity and reduce costA UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabricationProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable productsUniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced wasteFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageOffering excellent through-hole throwing power combined with excellent conformal microvia platingDelivering high plating efficiency to improve productivity and reduce costProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
View DetailsA patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsProcesses especially designed for operation in vertical and horizontal equipment respectivelyProducing uniform crystal grain structure to provide a smooth plated surface on rolled copper