Liquid Resists for Advanced Packaging Applications

DuPont Electronics & Imaging offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating. Both positive- and negative-tone versions are available with i-line, g-line and broadband compatibility, and there are options for a wide range of thicknesses necessary to meet the requirements of a variety of advanced packaging applications. To address the most demanding fine-pitch bump plating applications, a chemically-amplified i-line version with industry-leading compatibility with bumping metals is also available.

Product Lines

• Intervia™ BCPR-i 4500
• Shipley BPR™ 100
• Intervia™ BPN-65A