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High-performance Flex & Rigid-Flex Laminates and Adhesive Systems
Pyralux Laminates for Flexible and Rigid-Flex PCBs
DuPont has long been a market leader in laminates for flexible and rigid-flex PCBs. Our extensive family of Pyralux®, Interra® and Temprion® branded products expands possibilities for flexible laminates, embedded passives and thermal performance in demanding applications such as 5G networks, electric vehicles, and consumer electronics. The Pyralux®, Interra® and Temprion® portfolios includes a diverse collection of core dielectric materials and customized constructions that enable:
- Low loss for high-speed, high-frequency applications
- High service temperature for automotive and aerospace applications
- Options for single and double-sided, multilayer flex, and rigid-flex designs
Choose DuPont as your materials solutions partner to:
- Provide you the highest performing laminates
- Achieve design flexibility while maintaining excellent signal integrity
- Tap into decades of technical expertise
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What are Laminates?
Laminates provide the backbone for increasingly complex circuits built on both rigid and flexible (flex) substrates. They provide mechanical integrity to flex circuits while allowing designers the freedom to fit circuits into the available footprint. All the materials in multilayer flex laminates must be chosen to combine mechanical flexibility with sufficient electrical performance.
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Enabling 5G Networks and EVs
The laminate market is evolving to support the needs of high-speed, high-frequency circuits that connect 5G networks and power the next generation of consumer electronics. Flexible laminates are used in smartphone antennas and configurations that require thin substrates with tight bending radii. Such applications need thin, flexible designs made from low-loss materials to ensure signal integrity.
Electric vehicles (EVs) for both the consumer automotive market and military applications require laminates that can withstand high service temperatures for use in power modules and transmission control units. The ability of flexible laminates to meet this requirement expands product design options.
Laminate Materials For PCBs
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View DetailsDuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired. -
All-Polyimide Solutions
All-Polyimide Solutions
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
View DetailsDuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, thermal resistance and high reliability.DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibilityDuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility -
Epoxy Adhesive Solutions
Epoxy Adhesive Solutions
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
View DetailsPyralux® GPL Sheet Adhesive is a proprietary B-staged modified epoxy adhesive and is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions..DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties.DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties. -
Fluoropolymer Adhesive Solutions
Fluoropolymer Adhesive Solutions
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.
View DetailsDuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications. -
Thin Copper Clad Laminate
Thin Copper Clad Laminate
Interra® thin copper clad laminates for embedded capacitance.
View DetailsDuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.