Solderon™ ST-300T matte tin electroplating process is the newest innovation from DuPont Chemical in lead-free processes for Integrated Circuit Packages. The Solderon™ ST-300T matte tin process enables high-throughput for maximum cost benefit while delivering exceptional performance.

• Single additive system, ease of control
• High current density capability for high throughput in production
• Low whisker propensity
• Excellent solderability at lower solder pot temperature