Semiconductor Assembly Materials

Lid Seal Adhesives

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Adhesives and Dielectrics for Heterogeneous Integration

DuPont Electronics & Imaging’s family of adhesives and dielectrics provide leading-edge permanent bonding materials solutions to meet key requirements for today’s high-density, thinner packages used in mobile products and high-performance computing.

  • Photo-patternable dielectrics to bond chips requiring specific structures
  • Non-photo-patternable bonding materials using laser or dry-etch processes to bond chips with simple or limited pattern requirements

DuPont Electronics & Imaging’s permanent bonding materials for 3DICs, memory stacks, image sensors, and MEMS applications:

  • Create strong bonds
  • Ensure good planarization and reflow
  • Improve thermal stability and reliability
  • Provide good optical transparency across wide spectrum
 
 
 

  • Permanent bonding materials are adhesives and dielectrics used to assemble IC logic chips, memory chips, image sensor devices, microelectromechanical systems (MEMS) devices, and more into high-density heterogeneously-integrated packages. These high-density, ultra-thin electronic packages are needed for artificial intelligence (AI) in high-performance computers, data centers, 5G, and high-end mobile products.

  • When building today's high-density, thinner electronics packages, semiconductor device manufacturers rely on permanent bonding materials for stacking chips using either chip-to-wafer or wafer-to-wafer stacking processes

  • DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.

Semiconductor Assembly Materials

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  • Die Encapsulants

    Die Encapsulants

    Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.

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  • Permanent Bonding Dielectrics

    Permanent Bonding Dielectrics

    Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.

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What Materials do you need?

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