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Metallization for Multi-layer Boards
Enabling high-performance rigid boards
DuPont’s metallization and imaging products act as key enabling technologies for the high-end multi-layer PCBs that reside in computers, smartphones, and automobiles. As you increase layer count, you can’t afford to compromise reliability. We offer a variety of products that will allow your products to perform their best. Materials include:
- Desmearing materials to swell the dielectric for more efficient and effective etching
- Stable electroless copper to ensure enhanced coverage for through-hole plating
- DC plating of electrolytic copper to uniformly fill vias in high-layer-count boards
Choose DuPont as your materials solutions partner to:
- Enhance the reliability of your high-layer-count boards
- Create easy-to-use solutions that streamline the PCB metallization process
- Find the right combination of materials optimized for your application
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High Aspect Ratio Board Challenges
The number of layers in PCBs has increased to the point where etching and depositing metal can be a performance-limiting step. Holes are narrower in diameter and deeper than ever before, making via preparation, coating, and filling critical. High-speed, high-frequency applications are especially sensitive. Metallization needs to be tailored to the dielectric material and the board geometry to ensure reliable performance of HAR boards with small feature sizes.
Metallization Materials for PCBs
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Multi-Layered Boards
Multi-Layered Boards
Metallization to enable high-performance rigid PCBs.
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageDesigned for use with periodic pulse reverse (PPR) platingDelivering high plating efficiency to improve productivity and reduce costA UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabricationProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable productsUniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced wasteFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
View DetailsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityProviding uniform copper deposits by ensuring even absorbtion catalyst on dielectric materialsA high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceOffering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substratesProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
View DetailsDesigned for both horizontal and vertical processing of innerlayersFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageOffering excellent through-hole throwing power combined with excellent conformal microvia platingDelivering high plating efficiency to improve productivity and reduce costProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
View DetailsA patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsProcesses especially designed for operation in vertical and horizontal equipment respectivelyProducing uniform crystal grain structure to provide a smooth plated surface on rolled copper