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Semiconductor Fabrication and Packaging Materials
End-to-end materials solutions to support the semiconductor manufacturing process
DuPont’s rich history of experience and innovation has deep roots in the semiconductor fabrication industry. Our broad portfolio and expertise support many segments, from advanced chip manufacturing processes, to advanced packaging and assembly, to compound semiconductor device fabrication.
We offer complementary, reliable, high-quality materials sets to support both today’s high-volume manufacturing processes and advanced technology for the future. Through close collaboration with our customers, we develop solutions to address leading-edge technology challenges that are critical to advancing diverse market drivers. We work with our customers to develop or place materials that meet their specific needs, including technical performance and cost-of-ownership improvements.
Our materials are valuable building blocks for today’s advanced microelectronics found in everything from consumer electronics to high-end data centers, automotive applications, medical devices, the Internet of Things, artificial intelligence, power electronics and more.
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What are Semiconductor Fabrication Materials?
At DuPont, we define semiconductor fabrication materials as chemistries and other products critical for wafer processing in the fabrication of silicon die, including microlithography, chemical mechanical planarization, and cleaning solutions, through to advanced wafer-level packaging processes, as well as other related technologies.
Semiconductor Materials
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View Details- CMP Slurries
A range of offerings for chemical mechanical planarization (CMP) including Novaplane™, Optiplane™, Acuplane™ and Klebosol® slurries.- CMP Slurries
A range of offerings for chemical mechanical planarization (CMP) including Optiplane™, Acuplane™ and Klebosol® slurries. -
View Details- Photoresists
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.- Electronic Grade Polymers
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation. -
View Details- EKC® Strippers & Rinses
Strippers to remove photoresist used during the lithography process- Photoresist Removers
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces- Post-Clean Treatments
Post-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.- Post-Etch Residue Removers
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.- Post-Etch Residue Removers
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.- Removers for LED Fabrication
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts.- Removers for LED Fabrication
Enable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts- WLP Photoresist Removers & TSV Cleaners
Formulations optimized to effectively remove thick and thin resists used for TSV masks and wafer bumping by solder electroplating or stencil printing. -
Dual Damascene Copper
Dual Damascene Copper
Since 2006, leading-edge semiconductor manufacturers have relied upon DuPont Electronics & Imaging's dual damascene products for achieving semiconductor technology nodes below 20nm. What's our secret?
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Semiconductor Packaging Materials
Semiconductor Packaging Materials
With more than 50 years invested in technology development, DuPont Electronics & Imaging understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas.
View Details- Copper Redistribution Layer
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.- Packaging Dielectrics
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.- Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.- Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs -
View Details- Die Attach Adhesives
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Imaging for extraordinary solutions.- Die Attach Adhesives
Ordinary die-attach adhesives suit ordinary chip applications. But when a chip design must deliver reliable performance in extreme temperatures, high moisture, or stressful environments look to DuPont Electronics & Imaging for extraordinary solutions.- Die Encapsulants
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.- Die Encapsulants
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.- Lid Seal Adhesives
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.- Lid Seal Adhesives
DuPont’s portfolio of silicone-based lid-seal adhesives are designed to handle the high functionality of today’s advanced packaging processes, delivering the performance needed for today’s high-performance computing, mobile and automotive electronic applications.- Permanent Bonding Dielectrics
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.- Permanent Bonding Dielectrics
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.- Thermal Interface Materials
Our thermally conductive silicones are designed to handle the heat dissipation of today’s advanced electronic devices. -
Semiconductor Silicone Materials
Semiconductor Silicone Materials
These materials are essential to a number of semiconductor process steps. They include chemical vapor deposition (CVD)/atomic layer deposition (ALD) gas/precursor, and spin-on dielectrics (SOD).
View Details- Si Precursors
Silicon precursors are high-purity gas or liquid materials used in key steps during the manufacture of semiconductor devices.- Si Precursors
Silicon precursors are high-purity gas or liquid materials used in key steps during the manufacture of semiconductor devices.- Spin-on dielectrics
Spin-on dielectric materials to make multilevel metal ICs more planar, reducing process complexity and cost.- Spin-on dielectrics
Spin-on dielectric materials to make multilevel metal ICs more planar, reducing process complexity and cost. -
View Details- Silicon Carbide Wafers & Epitaxy
DuPont is your reliable global source of leading-edge, production-proven, high-crystal quality silicon carbide (SiC) wafers, and epitaxy services.
