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Designed to Protect High-Performance IC Chips
DuPont Electronics & Imaging’s line of packaging dielectrics protect today’s high-performance IC chips from physical, chemical, and electrical damage by insulating distribution wiring from the chip to the package substrate to the circuit board.
Designed to meet the demands of advanced wafer level packaging (WLP) architectures for both passivation and redistribution layer applications, our BCB-based Cyclotene™ and epoxy-based Intervia™ dielectric materials provide:
- Low cure temperature
- Low loss
- Good thermal stability
- Chemical resistance
- Good optical properties
- Platform to invent new materials
Our patented, advanced formulations give you:
- Higher throughput
- Improved device reliability
- High resolution
- The capability to meet performance requirements of high-end devices
Product lines:
- Intervia™ Photodielectric
- Cyclotene™ 3000 Series Advanced Electronic Resins
- Cyclotene™ 4000 series Advanced Electronic Resins
- Cyclotene™ 6000 series Advanced Electronic Resins
Semiconductor Packaging Materials
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Packaging Dielectrics
Packaging Dielectrics
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
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View DetailsHVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility. -
Under Bump Metallization
Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
View Details -
View DetailsWafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating. -
Through Silicon Via Copper
Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
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Copper Redistribution Layer
Copper Redistribution Layer
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
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