Twitter
LinkedIn
Email
Semiconductor Packaging Materials That Span the Spectrum
A Broad Portfolio of Materials for All Types of Advanced Semiconductor Packages
With more than 50 years invested in technology development, DuPont Electronics & Imaging understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas.
We draw from other areas of the company to leverage expertise across the entire electronics manufacturing supply chain.
Through close relationships with leading-edge manufacturers, we develop new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out wafer level packaging and through silicon vias (TSVs). We are technology leaders in electroplating materials used for underbump metallization (UBM), copper redistribution layer (RDL), Cu pillars, and solder bumps, along with polymers and dielectrics for RDL. Other advanced materials include photoresists and TSV fill.
Choose DuPont as your materials solutions partner to:
- Get a complete solution, not just materials
- Tap into years of expertise and technology from across Electronics & Imaging
- Benefit from development that stays ahead of the industry trends
Product Families
- Copper Pillar Plating
- Copper Redistribution Layer
- Solder Bump Plating
- Under Bump Metallization
- Bump Plating Photoresists
- Through Silicon Via Copper
- Packaging Dielectrics
-
What Are Semiconductor Packaging Materials?
Semiconductor packaging materials are a class of electronic solutions used to form the connection of the Semiconductor packaging materials are a class of electronic solutions used to form the connection of the IC chip to the package substrate, another package or directly to the printed circuit board. These materials are critical to semiconductor wafer-level packaging processes, heterogeneous integration, and 3D integration technologies.
-
Designed for the Heterogeneous Integration Roadmap
Today's leading-edge electronics are expected to have more functionality packed in a smaller form factor, using less power, while improving performance and reliability. These devices power mobile devices, high performance computers, the IoT, memory, automotive electronics, the 5G networks of the future and more. They rely on semiconductor packaging materials that follow the Heterogeneous Integration Roadmap (HIR) and are designed to meet these stringent requirements.
Semiconductor Packaging Materials
-
Copper Redistribution Layer
Copper Redistribution Layer
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
VIEW DETAILS -
VIEW DETAILS- Solderon™ BP TS 6000 Tin-Silver Plating Chemistry
HVM-proven tin-silver plating chemistry for lead-free, fine-pitch solder bump applications with industry-leading process versatility. -
Under Bump Metallization
Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
VIEW DETAILS -
VIEW DETAILSWafer-level packaging dry-film photoresist solutions for 3DIC, fan out, bumping, copper pillar and redistribution applications.DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating. -
Through Silicon Via Copper
Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
VIEW DETAILS -
Packaging Dielectrics
Packaging Dielectrics
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.