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Pyralux® Acrylic-based Adhesive Solutions
DuPont offers a complete line of acrylic-based adhesive systems that offer superior bond strength and flexibility in high volume applications.
Many standard and customized constructions of core dielectric, adhesive, and copper thicknesses are available to meet today's demanding design requirements requiring multiple high-temperature lamination cycles.
Laminate Materials For PCBs
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Acrylic-based Adhesive Solutions
Acrylic-based Adhesive Solutions
Superior bond strength and flexibility for high volume applications
DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating.DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications in the consumer electronics industry for over 35 years with a proven record of consistency and dependability.DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired.DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired. -
All-Polyimide Solutions
All-Polyimide Solutions
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
VIEW DETAILSDuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing are required.
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.
DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that has excellent thermal, chemical and mechanical properties ideal for use in high reliability flex and multilayer flex circuitry.
Pyralux® HT is an all polyimide bonding film with the highest service temperature available today and low loss performance when paired with Pyralux® AP.
DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. Paired offerings of double sided and single sided clads enable multi-layer construction of antenna and feedlines with good material compatibility
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Epoxy Adhesive Solutions
Epoxy Adhesive Solutions
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
VIEW DETAILSPyralux® GPL Sheet Adhesive is a proprietary B-staged modified epoxy adhesive and is primarily utilized to bond flexible inner layers or rigid cap layers in flexible and rigid-flex constructions..DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired.DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties.DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but similar mechanical and process properties. -
VIEW DETAILSDuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications.DuPont™ Pyralux® TK is a fluoropolymer/polyimide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications. -
VIEW DETAILSDuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.Interra® HK04M is DuPont’s next generation embedded capacitance laminate, which has been optimized to handle thinner dielectric layers and further reduce the impedance between power and ground planes in a printed wiring board.