Metal leadframes appear inside a variety of IC package types, including a quad flat package (QFP) and quad flat no-leads package (QFN). Light-emitting diodes (LEDs) are also built in leadframe packages. Leadframes require a variety of finishes depending on the package design and end application.

Two applications are driving demand for high-performing IC leadframes. The automotive electronics industry is exploding, with an ever-increasing number of components per vehicle. High-end consumer electronics continue to push the envelope on package dimensions.

A higher level of device integration is driving the development of unique package designs and a trend toward packages with a higher number of I/O, finer pitch, and smaller footprint. As package size shrinks, leadframes become more critical for component reliability, requiring more complex surface treatments.

The silver-plated surface of LED leadframes requires a high-quality electrolytic finish to achieve the reliable wire bonding, sufficient brightness, and high reflectivity. This is especially important for high-output LEDs in residential, commercial, and street lighting and automobile headlights.