Printed Circuit Board Materials

 
 
 
 
 
 

High-performing materials to enhance PCB reliability for flexible and rigid boards

DuPont brings a deep understanding of materials science to the printed circuit board (PCB) market. We provide materials that support all aspects of PCB manufacturing for many types of PCBs: single- or double-sided boards and flexible, rigid-flex, or rigid configurations.

Tap into our long history as a market leader in flexible PCB laminates, dry film photoresists, and high-reliability metallization to determine the best combination of materials to enhance the performance of your PCBs. We allow you to push the design envelope and create products that perform faster and more reliably.

Our broad portfolio of PCB materials includes films, laminates, photoresists, and metallization. We continue to bring new products to market to create reliable PCBs with increased circuit density that function well under demanding environmental conditions.

Choose DuPont as your materials solutions partner to:

  • Get a complete solution, not just materials
  • Enable smaller and smarter PCBs
  • Improve performance and enhance reliability
 
 
 
  • PCB manufacturing involves many steps—depositing metal and photoresist layers, imaging, etching, and stripping—all of which require materials tailored for a specific function. Whether they remain on the board or are removed during the manufacturing process, all PCB materials affect the performance and reliability of the final product.

  • The drive toward miniaturization in the consumer electronics and telecom sectors requires PCBs with higher circuit density, which puts greater demands on the metal and dielectric layers as line widths and spacings decrease. Choosing the right materials improves yield and controls manufacturing costs.

    PCBs in automotive applications must operate reliably under conditions of high temperature and high voltage, where signal integrity is critical for safety. As the number of boards and components in vehicles increases, more function must be packed into a smaller space, elevating the importance of materials that enable compact, highly reliable designs.

Printed Circuit Board Materials

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    • Flexible Circuits

    Copper plating to meet the demands of flexible PCBs.
     
     
     
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    • Acrylic-based Adhesive Solutions

    Superior bond strength and flexibility for high volume applications

    • Acrylic-based Adhesive Solutions

    Superior bond strength and flexibility for high volume applications

    • All-Polyimide Solutions

    DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

    • All-Polyimide Solutions

    DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.

    • Epoxy Adhesive Solutions

    Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

    • Epoxy Adhesive Solutions

    Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.

    • Fluoropolymer Adhesive Solutions

    DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.

    • Thin Copper Clad Laminate

    Interra® thin copper clad laminates for embedded capacitance.
     
     
     
  • Polyimide Films

    Polyimide Films

    From circuits in cameras in space to next-gen photovoltaic cells, polyimide films are helping make extraordinary new design possibilities actually happen.

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    • Kapton® GS Heat Spreading Film

    Enables excellent “in plane” thermal conductivity when converted into artificial graphite sheet. Used as a thermal dissipative material in a variety of applications to consumer electronics such as cell phones and tablet computers
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    • Kapton® MT and Kapton® FMT Thermally Conductive Films

    These films with thermal conductivity of 0.45 W/m·K can be used alone or combined with other materials as a laminate for added functionality. Kapton® MT film comes in a variety of thicknesses, even as thin as a little over 25µm.
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    • Kapton® MT+ Higher Thermally Conductive Film

    These films with superior thermal conductivity of 0.8 W/m·K are available as thin as 38 µm up to 127 µm. Lowers operating temperature by 20–45°C in e-motors as a NKN slot liner. Increases power output by 10-30% for PTC heaters.
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    • Kapton® Polyimide films

    Maintains its unique combination of mechanical properties under the harshest of conditions.
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    • Kapton® Polyimide films

    Maintains its unique combination of mechanical properties under the harshest of conditions.
     
     
     
    • Advanced Package

    The advanced solution for tall copper pillar process in advanced packaging application.
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    • Conductive Materials for Hybrid Circuits

    Conductor materials from DuPont are available in a wide variety of traditional thick film compositions, including silver, gold, platinum and their alloys.

    • Conventional

    Used in tenting, plating, akaline etching or innerlayer applications.
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    • Defogger and Defroster Systems

    Silver-based thick film pastes from DuPont are raising the bar for material solutions for defroster and defogger systems, offering the best system cost/reliability/performance available today.
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    • DuPont Smart Materials - Beauty with Invisible Functionality

    The Smart Materials business is focused on creatively integrating electronic functionality and traditional building materials to provide value and information not previously accessible to building owners and operators.
    Automotive Sensor

    • Electronic Materials for Sensors

    DuPont develops innovative sensor materials for customers around the globe, suitable for a range of applications and temperatures, including high and low temperature automotive applications, biomedical sensors, touch sensors, and more.

    • Flexible Circuits

    The advanced solution for fine line FPC design.

    • High Density Interconnect

    The advanced dry film photoresist for fine line HDI.

    • IC Substrates

    The advanced fine line direct imaging photoresist solution for IC substrate application.
    Membrane Touch Switch

    • Membrane Touch Switch Materials

    DuPont offers a full range of materials for the membrane touch switch (MTS) market, allowing designers to strike a winning balance between performance and cost.

    • Multi-layered Boards

    Next Generation T/E and P/E direct imaging photoresist.
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    • Printed Materials for Patient Monitoring and Warming

    Innovative printed materials from DuPont for patient care are helping to improve comfort, recovery, and outcomes for patients around the world.

    • Screen Printed Inks (CB Series)

    The CB Series of screen printed ink materials are used for additive, low temperature processing on both rigid and flexible printed circuit boards (PCBs).
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    • Wearable Electronics

    DuPont is a leader in the development of materials for printed electronics applications, including wearable electronics and smart fabrics