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High-performing materials to enhance PCB reliability for flexible and rigid boards
DuPont brings a deep understanding of materials science to the printed circuit board (PCB) market. We provide materials that support all aspects of PCB manufacturing for many types of PCBs: single- or double-sided boards and flexible, rigid-flex, or rigid configurations.
Tap into our long history as a market leader in flexible PCB laminates, dry film photoresists, and high-reliability metallization to determine the best combination of materials to enhance the performance of your PCBs. We allow you to push the design envelope and create products that perform faster and more reliably.
Our broad portfolio of PCB materials includes films, laminates, photoresists, and metallization. We continue to bring new products to market to create reliable PCBs with increased circuit density that function well under demanding environmental conditions.
Choose DuPont as your materials solutions partner to:
- Get a complete solution, not just materials
- Enable smaller and smarter PCBs
- Improve performance and enhance reliability
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What are PCB Materials?
PCB manufacturing involves many steps—depositing metal and photoresist layers, imaging, etching, and stripping—all of which require materials tailored for a specific function. Whether they remain on the board or are removed during the manufacturing process, all PCB materials affect the performance and reliability of the final product.
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Smaller, More Reliable Boards
The drive toward miniaturization in the consumer electronics and telecom sectors requires PCBs with higher circuit density, which puts greater demands on the metal and dielectric layers as line widths and spacings decrease. Choosing the right materials improves yield and controls manufacturing costs.
PCBs in automotive applications must operate reliably under conditions of high temperature and high voltage, where signal integrity is critical for safety. As the number of boards and components in vehicles increases, more function must be packed into a smaller space, elevating the importance of materials that enable compact, highly reliable designs.
Printed Circuit Board Materials
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View Details- Acrylic-based Adhesive Solutions
Superior bond strength and flexibility for high volume applications- Acrylic-based Adhesive Solutions
Superior bond strength and flexibility for high volume applications- All-Polyimide Solutions
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.- All-Polyimide Solutions
DuPont adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.- Epoxy Adhesive Solutions
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.- Epoxy Adhesive Solutions
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.- Fluoropolymer Adhesive Solutions
DuPont’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.- Thin Copper Clad Laminate
Interra® thin copper clad laminates for embedded capacitance. -
Polyimide Films
Polyimide Films
From circuits in cameras in space to next-gen photovoltaic cells, polyimide films are helping make extraordinary new design possibilities actually happen.
View Details- Kapton® GS Heat Spreading Film
Enables excellent “in plane” thermal conductivity when converted into artificial graphite sheet. Used as a thermal dissipative material in a variety of applications to consumer electronics such as cell phones and tablet computers- Kapton® MT and Kapton® FMT Thermally Conductive Films
These films with thermal conductivity of 0.45 W/m·K can be used alone or combined with other materials as a laminate for added functionality. Kapton® MT film comes in a variety of thicknesses, even as thin as a little over 25µm.- Kapton® MT+ Higher Thermally Conductive Film
These films with superior thermal conductivity of 0.8 W/m·K are available as thin as 38 µm up to 127 µm. Lowers operating temperature by 20–45°C in e-motors as a NKN slot liner. Increases power output by 10-30% for PTC heaters.- Kapton® Polyimide films
Maintains its unique combination of mechanical properties under the harshest of conditions.- Kapton® Polyimide films
Maintains its unique combination of mechanical properties under the harshest of conditions. -
- Advanced Package
The advanced solution for tall copper pillar process in advanced packaging application.- IC Substrates
The advanced fine line direct imaging photoresist solution for IC substrate application.- Screen Printed Inks (CB Series)
The CB Series of screen printed ink materials are used for additive, low temperature processing on both rigid and flexible printed circuit boards (PCBs).
