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Protecting High-Value Microelectronics
DuPont Electronics & Imaging’s high-performing silicone die encapsulants help protect high-value microelectronics in demanding automotive, communications, and consumer electronics applications.
Formulated to tailor rheology for ease of application and low ionic impurities, these materials are designed to protect sensitive semiconductor devices with void-free application around complex packaging designs. They are compatible with commonly-used dispensing and screen printing techniques.
They feature:
- Low ionic content
- Low moisture
- Minimal shrinkage during processing
- Low modulus for mechanical stress protection
- Compatible with commonly-used dispensing and screen printing technique
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Why Use Die Encapsulants?
As electronics are used in increasingly harsh environments, it’s more critical than ever to protect sensitive devices or components against thermal and mechanical stress.
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Our Semiconductor Assembly Portfolio
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Semiconductor Assembly Materials
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Die Encapsulants
Die Encapsulants
Our silicone die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free solder processing or stringent thermal stress-reliability testing conditions.
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Permanent Bonding Dielectrics
Permanent Bonding Dielectrics
Photo-patternable dielectrics and non-photo-patternable adhesives make possible chip-to-wafer and wafer-to-wafer stacking for heterogeneous integration.
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