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Metallization for Flexible Circuits
Enabling high-density flexible boards
DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of flexible and rigid-flex circuits built with polyimide. As more applications migrate to flexible boards, DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.
Choose DuPont as your materials solutions partner to provide:
- Cost-effective copper plating
- Balanced pH that is suitable for chemically-sensitive polyimide substrates
- Multiple plating options tailored to your specific application
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Meeting Flexible PCB Demands
Flexible circuits pose unique challenges for metallization. The tight bending radii present in many design configurations require flexible metal layers with high electrical conductivity. Copper can be an ideal material when deposited in a manner that is compatible with the flexible circuit manufacturing process, which is often done on roll-to-roll equipment.
Metallization Materials for PCBs
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A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsProcesses especially designed for operation in vertical and horizontal equipment respectivelyProducing uniform crystal grain structure to provide a smooth plated surface on rolled copper
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View DetailsFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageDesigned for use with periodic pulse reverse (PPR) platingDelivering high plating efficiency to improve productivity and reduce costA UV-curable acrylic hybird ink that redefines the etching process for PCB innerlayer fabricationProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsA wide range of supporting products for developing, etching and stripping processes that compliment our photo imageable productsUniform thin coatings provide improved surface conformance, improved fine-line etching performance, as well as lower costs and reduced wasteFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
View DetailsFormulated to provide improved physical properties and produce exceptionally fine-grain and low-stress depositsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityA solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stageOffering excellent through-hole throwing power combined with excellent conformal microvia platingDelivering high plating efficiency to improve productivity and reduce costProviding complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates -
View DetailsA self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applicationsAn Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliabilityProviding uniform copper deposits by ensuring even absorbtion catalyst on dielectric materialsA high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearanceOffering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substratesProviding through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivityFormulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBsFormulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates
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