All Polyimide High Temperature Bonding Film - Pyralux® HT

DuPont™ Pyralux® HT bonding film can be used in conjunction with Pyralux® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after processing. Pyralux® HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance, advanced material performance, and high reliability

System Features:

• >225°C IPC service temperature
• Excellent thermal resistance
• UL 94V-0
• Low loss characteristics
• Excellent punching and drilling performance
• Excellent dielectric thickness tolerance/electrical performance
  
• High adhesion
  
• Halogen-free
• Low outgassing

Bonding Film Features:

• Able to withstand multiple lamination cycles without degradation
• Excellent encapsulation and conformation over circuitry
• Low resin flow
• No refrigeration required for storage

Construction:

• Available in thicknesses of 1.5, 2.0, and 3.0 mils

Certifications:

• Certified to IPC 4203A/24
• UL 94V-0