Microfill™ THF-100 Bath is designed to provide through hole fill of inner core layers for IC-Substrate PCB. Compared to conventional via fill processes, this new technology improves reliability, and both electrical and thermal conductivity. Customers benefit from reduced process cost and a shortened new manufacturing process.
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Microfill™ LVF Electrolytic Copper
Behind the Scenes of DuPont’s Finalists for the 2015 R&D 100 Awards: Part 1 | Microfill™ THF Electrolytic Copper