Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

The Copper Gleam™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.

Key Benefits:

• Excellent throwing power on through-holes and microvias
• Exceptional panel plating distribution
• Exceptional leveling performance on panel surface and inside through holes
• Round plated shape on via bottom
• Good thermal reliability

                                             Excellent Throwing Power