Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.

Key Benefits:

• Exceptional Interconnect Reliability
• Horizontal or vertical application
• Excellent bath stability and performance
• Reduced bath maintenance
• Reduction in solution volume growth
• Low-build or high-build deposition

             Optimum grain structure to improve reliability and performance