Advanced Flip-Chip packages demand higher functionality in increasingly fine pitch substrates, resulting in the need to reliably create fine metal features. DuPont™ Microfill™ LVF IV Acid Copper plating process has been designed to meet these needs, using insoluble anodes and direct current (DC) plating in electroplating systems designed for substrate manufacturing.

• Designed for pattern plate capability, with excellent laser micro-via fill and pattern plate uniformity of Flip-Chip substrates.
• DC process with insoluble anodes to minimize idle-time effects.
• Bright, highly leveled, ductile deposit
• Easily analyzed and controlled by conventional CVS techniques.
• Highly tunable process for different product requirements.