Conductron™ DP / DP-H Direct Plate are processes especially designed for operation in vertical and horizontal equipment respectively. The Conductron™ Process can be applied for panel plating as well as pattern plating. The system is suitable for double sided, flex/rigid-flex as well as multilayer boards.

Key Benefits:

• Provides excellent copper-to-copper adhesion
• Short processing time
• Simplified process control
• Low process chemical consumption
• Reduced chelate content for easy waste treatment
• Formaldehyde-Free