Photoresists

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Photoresists

Meeting Generations of Lithography Process Requirements

DuPont offers a robust, production-proven photoresist product line with materials options that meet the requirements across generations of lithography processes from 365nm down to 13.5nm wavelengths, and exposures that achieve features from 280nm to 20nm.

The quest to achieve ever smaller technology nodes means photoresists must offer higher and better resolution with a wider depth of focus, with fewer defects. At the same time, legacy nodes rely on tried and true formulations. From our i-line/g-line, to our 193 and KrF product families, DuPont has photoresists to match your needs.

When combined with DuPont’s etching, developing and ancillary products, you get a total materials solution to support your semiconductor manufacturing processes.

Our broad portfolio also allows us to tailor photoresists to meet specific customer specifications.

i-Line Products

Our legacy i-Line (365nm) photoresists are formulated to support different thickness requirements while achieving high resolution and low defects. 

Related Products:

  • SPR™ 3 Photoresist
  • SPR™ 700 Photoresist
  • MCPR™ Photoresists

DUV Products

Our DUV (248nm) photoresists show excellent product performances with low defects for various applications. 

  • UV™ Positive Tone Resist supports exposure and early development. It achieves high resolution to accommodate smaller pattern sizes.
  • UVN™ Negative Tone Resist, in which the exposure is developed in reverse. Scum-free, UVN™ resist is the optimal solution for deep-trench patterning.
  • SL™ Resist is our low-temperature resist that bakes at less than 100C. It features high resolution and is suitable for small pattern sizes.

EPIC™ Photoresists

EPIC™ Photoresists are a series of 193 resists widely used for 193 processes with and without topcoats. DuPont’s EPIC™ IM Resist is designed for the unique environment created by immersion lithography, in which water between the lens and the wafer enables exposure of finer patterns.

  • Prevents resist components that leach into water from penetrating the resist film
  • Creates a barrier layer between the water and the resist, making a barrier layer unnecessary, saving customers time and money
 
 
 
  • Today’s photoresists must serve a broad and wide spectrum of coverage in terms of bake temperature and exposure times. DuPont has developed a comprehensive product line to support both legacy and next-generation lithography processes.

 
 
 

Lithography Materials and Services

 
 
 
 
 
 
 
 
 

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