DuPont’s state-of-the-art advanced overcoat products decrease the occurrence of defects before or after wafer patterning. Our unique formulations provide you with new solutions for today’s patterning challenges, enabling you to reach critical dimensions that can’t be achieved through conventional lithography processes alone. Scaling to advanced nodes without extreme ultra violet (EUV) lithography is now possible.
DuPont’s advanced overcoat product lines for lithography include:
Topcoats: Designed for positive tone photoresists, our positive tone development topcoats increase hydrophobicity of the photoresist surface, decreasing defects.
NTO™ Overcoats: Intended for yield enhancement, our negative tone, spin-on formulations create a uniform surface across multiple resists with different surface properties. These materials allow for multiple scanner adjustments to be made as if it were a single resist. NTO Overcoats feature high hydrophobicity and achieve a high contact angle.
CTO™ Overcoats: These spin-on alternatives to plasma-etch processes are a low-cost way to trim critical dimensions by reducing bridging defects that form at the top of the resist. CTO Overcoats reduce scum in darkfield features and can be used to clean difficult-to-remove resist from isolated trenches.
Advanced overcoats are materials intended for use in conjunction with photoresists, either before or after the photolithography step. They are designed to prevent defects and improve the lithography process window.
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