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Metrology & Imaging Services

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Lithographic Imaging Services & Metrology for Defect Testing

Our Fabs Can Help with Your Imaging and Metrology Projects

Let’s talk about how the technical experts in our fabs can help with your lithography projects. In addition to supplying materials for lithography, with our advanced lithographic imaging and metrology equipment, we can help with other aspects of your workflow. Services available include measurement, defect testing, process design, or supplying patterned wafers.

Our fabs have a range of tools from g-line and i-line lithography to ArF immersion lithography, and to better support our customers and the semiconductor industry, we are now able to make these available for custom or batch tests. Tests can be done on a one-time basis or long-term as a recurring event. We also have a full suite of metrology tools that can be used in conjunction with lithographic imaging performed at our facility or on wafers imaged off-site. Our experts are also available to assist with the development of new lithographic processes and we can supply our lithography materials (such as photoresists, anti-reflective coatings and ancillaries) as part of a process design or project.

Read on to see the types of lithographic imaging and metrology tools available, as well as examples of services we can offer. Please don’t hesitate to contact us with any potential project, even if it is not listed here.

 
 
 

  • The following examples show the types of work we can do using our equipment:

    • CD Measurement: Measurement of CDs across features that you specify for your patterned ArF resist wafers, including data analysis and a summary report.
    • ArF Imaged Wafers: Imaging of wafers patterned using our photoresist, antireflective coatings, and top coat products using immersion ArF conditions.
    • Defect Analysis: Measurement, review, and defect analysis (including EDX) for your patterned wafers.
    • Process Development: The development of a new patterning process using our resists and ancillaries, based on your design requirements. Process testing using your production wafers.
    • Material Screening: Coating and ArF patterning evaluation of sample materials, including a summary of test results and data.

    These examples represent a small sampling of the types of services we can offer. Lithographic imaging and metrology are often custom designs as determined by the needs of the project, so please don’t hesitate to contact us to discuss your specific project needs.

  • Technology

    Wafer Size (mm)

    Capability

    ArF (193nm Immersion)

    300

    Coat and Pattern

    ArF (193nm Dry)

    200

    Coat and Pattern

    KrF (248nm)

    200

    Coat and Pattern

    i-line (365nm)

    200

    Coat and Pattern

    i-line (365nm)

    100

    Coat and Flood Exposure

    Broad Band

    200

    Coat and Pattern

    Broad Band

    100

    Coat and Flood Exposure

    g-line (436nm)

    100

    Coat and Pattern

  • Metrology

    Wafer Size (mm)

    Description

    Thin Film Measurement

    100/200/300

    Optical Parameter

    Critical-Dimension Scanning
    Electron Microscopes (CD-SEM)

    200/300

    CD Measurement

    Defect

    200/300

    Film Defect Inspection Tool,
    Patterned Defect Inspection Tool,
    Defect Review Tool,
    Scanning Electron Microscopes

    Scanning Electron Microscopes

    All

    Scanning Electron Microscope,
    Cross Sectional Image

    Scanning Electron Microscopes

    100/150/200

    Top Down, X-ray,
    Back Scatter,
    Defect Review

  • Capability

    Wafer Size (mm)

    Tool Set

    Dissolution Rate

    100/150

    Single Point DRM Laser, GCA, DNS

    Optical Density

    100

    UV-Vis, GCA

    Dill

    10

    Flood Exposure Tool, UV-Vis, GCA
 
 
 

Lithography Materials and Services

 
 
 
 
 
 
 
 
 

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and solve the challenges of our time.

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