DuPont™ Riston® dry film photoresist revolutionized the way printed circuit boards were fabricated when it was invented by DuPont 40 years ago.
The original dry film photoresist invented by DuPont is the industry standard for high yield, productivity, and ease of use in all imaging applications. DuPont™ Riston® products meet the industry demands for finer features, higher quality and lower cost in all types of plating and etching applications.
Used in tenting, plating, akaline etching or innerlayer applications.
Copper plating solutions for substrates in all types of advanced packages.
The advanced fine line direct imaging photoresist solution for IC substrate application
Our highly conformal copper plating will enable any HDI design to perform well.
Fine line direct imaging photoresist solution for HDI mSAP application
The advanced dry film photoresist for fine line HDI
The advanced solution for tall copper pillar process in advanced packaging application.
The advanced solution for tall copper pillar process in advanced packaging application
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