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Featured Solutions

EKC® Removal Chemistry Honored as Finalist in R&D 100 Awards

Innovative DuPont post-etch residue remover for semiconductor fabrication chosen as finalist for coveted R&D 100 award

Helping Advance DuPont’s Sustainability Commitment: PCMPSolv™ Cleaning Solutions

DuPont PCMPSolv™ family performs advanced post-CMP cleaning with safer-by-design, green chemistries.

Low-Loss Materials Key for High-Frequency Applications

DuPont laminates meet low-loss requirements for 5G and other high-data-rate applications, including IoT and autonomous cars

Protecting Space Exploration Vehicles and Satellites

Protection of Rover’s sophisticated equipment is crucial to the overall success of the mission.

DuPont Pyralux® AP to Aid Reliable Performance of Semikron-Danfoss eMPack® Modules Powering Next-Gen Electric Vehicles

DuPont (NYSE:DD) Interconnect Solutions, part of the Electronics & Industrial business, announced today a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles.

New digital hub features DuPont’s total solutions for advanced automotive interconnects

Kapton® Returns to the Moon

ESA Mission to Explore Jupiter’s Moons Features DuPont Technology

Kapton® protects Jupiter Icy Moons Explorer by providing thermal insulation against extreme temperatures encountered during the mission.

Viewpoints

Press-fit solutions address future automotive reliability requirements

To meet reliability standards, automotive PCBs migrate to solderless press-fit interconnections.

Transitioning to chromium-free etch technology for plating on plastics

Dow reports on its progress with a plating on plastics process free from hexavalent chromium.

Blog-Viewpoints-11-23-2016-Autonomous-cars-drive-next-gen-PCB-material-requirement.jpg

Autonomous cars driving next gen pcb material requirements

Why the automotive industry needs thermally stable PCB materials that withstand harsh environments.

How silver catalysts enhance PCB manufacturing

Silver catalysts provide good catalytic activity, high electrical conductivity, modest cost, and good process stability, making PCB manufacturing a candidate for use

Meeting the horizontal electroless copper plating challenge

How DuPont addresses reliability demands and increased complexity of HDI and IC package substrates.

Chromium-free etch technology for plating on plastic

How to eliminate hexavalent chromium when plating acrylonitrile butadiene styrene on plastic.

Silver Plating technology driving 200°C automotive apps

How we overcame technical challenges to develop a flexible, high-performance automotive solution.

Nickel electroplating without boric acid

To comply with EU REACH legislation, boric acid replacement electrolytes for nickel are in development, with boric acid-free nickel plating already demonstrated.

Increasing smartphone functionality through novel metallization

Finer PCB Line/Space requirements are needed to deliver performance and DuPont has the solution.

Knowledge

Copper electroplating fundamentals

This tutorial examines the concept of copper electroplating and how the process works, as well as its use in advanced packaging applications.

Examining unique TSV plating challenges

This tutorial examines the concept of copper through silicon via electroplating, which can increase reliability and decreases cost of subsequent process steps.

Blog-Knowledge-05-04-2017-Cleaning-up-PCB-final-finish-yanide-free-ENIG-coatings.jpg

Cleaning up PCB final finish: cyanide-free ENIG coatings

Reliable, cyanide-free ENIG surfaces delivers low gold porosity and excellent corrosion resistance.

Copper pillar electroplating tutorial

Learn about Cu pillar requirements and processing considerations for advanced chip packaging.

Managing fan-out wafer level packaging material properties, part 2

The key structures for FOWLP and considerations for managing material properties.

NASA’s Webb Telescope Keeping Cool with Ultra-thin DuPont™ Kapton® Polyimide Films

The excellent thermal and mechanical properties of Kapton® polyimide film make it an ideal material for space applications.

Addressing CMP slurry market drivers with the Optiplane™ Platform, Part 1

DuPont's Adam Manzonie explains how this slurry platform goes beyond 14nm node process requirements.

Innovation in CMP: The Ikonic™ polishing pad platform

Colin Cameron discusses DuPont's biggest CMP portfolio expansion and its value in the marketplace.

Inner-layer Copper Reliability of Electroless Copper Processes

Understanding material interactions helps PCB manufacturing control and interconnect reliability.

Flexible Circuits Increase Range and Safety for Vehicle Batteries

Increased electrification of vehicles is a growing technology trend, driven in large part by advances in lithium (Li)-ion cells and battery pack design.

Enhancing advanced PCB performance with corrosion-resistant electroless nickel

How to get excellent electrical and mechanical connections between advanced PCBs and IC packages.

DuPont Technology Protects Ingenuity Mars Drone Mission

Ingenuity took its maiden voyage over the Martian soil on April 19, 2021.

New Kapton® Insulation Lasts Longer on High-Performance Traction Motor Conductors

Addresses the impact of higher switching frequency and faster voltage rise on motor insulation; shows eight-fold improvement over standard polyimide insulators.

Blog-Knowledge-07-06-2016-Fan-out-wafer-level-packaging-matarials-evolution.jpg

Fan-out wafer-level packaging materials evolution

In the first of two parts, we examine the backstory of FOWLP and the markets it serves.

NASA’s Webb Telescope Keeping Cool with Ultra-thin DuPont™ Kapton® Polyimide Films

The excellent thermal and mechanical properties of Kapton® polyimide film make it an ideal material for space applications.

Fast, high-purity Cu plating enables next-gen devices

Copper plating forms critical connections from horizontal RDLs through vertical pillars.

Kapton® Films and Pyralux® Laminates Provide Superior Performance in Satellite/Spacecraft Applications

DuPont offers space satellite applications product selection guide to assist in the development of the next generation of space vehicles.

Inkjet printing for eco-friendly PCB etch processes

Inkjet printing improves etch capability to meet tight tolerances, complex patterns and more.

Lithographic Material Evolution Continues to Enable the Semiconductor Industry

CD scaling, 3D structures and escalating costs drive advances in lithography and enabling materials

Fine-tuning CMP slurries for 3D TSV processes

DuPont's Michelle Ho explains the role of CMP in 3D TSV processes and discusses CMP slurry design.

Industry Engagement

Silicon valley technology center hub for collaboration

The Center fosters technology collaboration across DuPont businesses and partners in the Bay Area.

DuPont experts to present at SPIE Advanced Lithography 2020

DuPont will share research as part of the Advances in Patterning Materials and Processes Conference at SPIE Advanced Lithography 2020

DuPont Interconnect Solutions Launches Virtual Expo

As you prepare to take on the next frontier of your industry, partner with DuPont. Let’s tackle tomorrow’s toughest challenges together.

Reddington Addresses Customers at IPC/APEX

Join DuPont at SEMICON Taiwan 2023

Come and meet our experts at SEMICON Taiwan 2023 to discover our range of innovative solutions and experience our diverse and inclusive culture. We can't wait to see you there

Featured Solutions

EKC® Removal Chemistry Honored as Finalist in R&D 100 Awards

Innovative DuPont post-etch residue remover for semiconductor fabrication chosen as finalist for coveted R&D 100 award

Helping Advance DuPont’s Sustainability Commitment: PCMPSolv™ Cleaning Solutions

DuPont PCMPSolv™ family performs advanced post-CMP cleaning with safer-by-design, green chemistries.

Low-Loss Materials Key for High-Frequency Applications

DuPont laminates meet low-loss requirements for 5G and other high-data-rate applications, including IoT and autonomous cars

Protecting Space Exploration Vehicles and Satellites

Protection of Rover’s sophisticated equipment is crucial to the overall success of the mission.

DuPont Pyralux® AP to Aid Reliable Performance of Semikron-Danfoss eMPack® Modules Powering Next-Gen Electric Vehicles

Fine-Line Patterning for SLPs Calls for High-Resolution Photoresist

Product miniaturization is driving demand for substrate-like PCBs (SLPs) with finer patterns, requiring advanced photoresist materials.

Thin Laminates as Embedded Capacitance for PDN Designs

Power distribution networks provide clean power for electronics. Using thin laminates for capacitance enables lighter end products with low signal noise

What drives a car that can drive itself? DuPont innovation.

On the autonomous road ahead, DuPont is helping catalyze a more sustainable world. With materials that vastly improve connectivity, reliability and processing speed.

DuPont announces new product brand name - Duroptix™ for LED silicone materials

Customers can continue to count on the same performance and durability of these high-performance silicone-based optical materials that they have come to trust.

Flexible laminates address flex circuits’ unique manufacturing challenges

Laminates designed for flexible substrates have numerous potential applications in consumer and industrial products

Advanced polyimides for more flexible high-speed 5G networks

DuPont's Pyralux® AP with RA copper offer an ideal flexible circuit option in the race to 5G.

New digital hub features DuPont’s total solutions for advanced automotive interconnects

Kapton® Returns to the Moon

ESA Mission to Explore Jupiter’s Moons Features DuPont Technology

Kapton® protects Jupiter Icy Moons Explorer by providing thermal insulation against extreme temperatures encountered during the mission.

Viewpoints

Press-fit solutions address future automotive reliability requirements

To meet reliability standards, automotive PCBs migrate to solderless press-fit interconnections.

Transitioning to chromium-free etch technology for plating on plastics

Dow reports on its progress with a plating on plastics process free from hexavalent chromium.

Autonomous cars driving next gen pcb material requirements

Why the automotive industry needs thermally stable PCB materials that withstand harsh environments.

How silver catalysts enhance PCB manufacturing

Silver catalysts provide good catalytic activity, high electrical conductivity, modest cost, and good process stability, making PCB manufacturing a candidate for use

Meeting the horizontal electroless copper plating challenge

How DuPont addresses reliability demands and increased complexity of HDI and IC package substrates.

Chromium-free etch technology for plating on plastic

How to eliminate hexavalent chromium when plating acrylonitrile butadiene styrene on plastic.

Silver Plating technology driving 200°C automotive apps

How we overcame technical challenges to develop a flexible, high-performance automotive solution.

Nickel electroplating without boric acid

To comply with EU REACH legislation, boric acid replacement electrolytes for nickel are in development, with boric acid-free nickel plating already demonstrated.

Increasing smartphone functionality through novel metallization

Finer PCB Line/Space requirements are needed to deliver performance and DuPont has the solution.

Knowledge

Copper electroplating fundamentals

This tutorial examines the concept of copper electroplating and how the process works, as well as its use in advanced packaging applications.

Examining unique TSV plating challenges

This tutorial examines the concept of copper through silicon via electroplating, which can increase reliability and decreases cost of subsequent process steps.

Cleaning up PCB final finish: cyanide-free ENIG coatings

Reliable, cyanide-free ENIG surfaces delivers low gold porosity and excellent corrosion resistance.

Copper pillar electroplating tutorial

Learn about Cu pillar requirements and processing considerations for advanced chip packaging.

Managing fan-out wafer level packaging material properties, part 2

The key structures for FOWLP and considerations for managing material properties.

NASA’s Webb Telescope Keeping Cool with Ultra-thin DuPont™ Kapton® Polyimide Films

The excellent thermal and mechanical properties of Kapton® polyimide film make it an ideal material for space applications.

Addressing CMP slurry market drivers with the Optiplane™ Platform, Part 1

DuPont's Adam Manzonie explains how this slurry platform goes beyond 14nm node process requirements.

Innovation in CMP: The Ikonic™ polishing pad platform

Colin Cameron discusses DuPont's biggest CMP portfolio expansion and its value in the marketplace.

Inner-layer Copper Reliability of Electroless Copper Processes

Understanding material interactions helps PCB manufacturing control and interconnect reliability.

Flexible Circuits Increase Range and Safety for Vehicle Batteries

Increased electrification of vehicles is a growing technology trend, driven in large part by advances in lithium (Li)-ion cells and battery pack design.

Enhancing advanced PCB performance with corrosion-resistant electroless nickel

How to get excellent electrical and mechanical connections between advanced PCBs and IC packages.

DuPont Technology Protects Ingenuity Mars Drone Mission

Ingenuity took its maiden voyage over the Martian soil on April 19, 2021.

New Kapton® Insulation Lasts Longer on High-Performance Traction Motor Conductors

Addresses the impact of higher switching frequency and faster voltage rise on motor insulation; shows eight-fold improvement over standard polyimide insulators.

Fan-out wafer-level packaging materials evolution

In the first of two parts, we examine the backstory of FOWLP and the markets it serves.

NASA’s Webb Telescope Keeping Cool with Ultra-thin DuPont™ Kapton® Polyimide Films

The excellent thermal and mechanical properties of Kapton® polyimide film make it an ideal material for space applications.

Fast, high-purity Cu plating enables next-gen devices

Copper plating forms critical connections from horizontal RDLs through vertical pillars.

Kapton® Films and Pyralux® Laminates Provide Superior Performance in Satellite/Spacecraft Applications

DuPont offers space satellite applications product selection guide to assist in the development of the next generation of space vehicles.

Inkjet printing for eco-friendly PCB etch processes

Inkjet printing improves etch capability to meet tight tolerances, complex patterns and more.

Lithographic Material Evolution Continues to Enable the Semiconductor Industry

CD scaling, 3D structures and escalating costs drive advances in lithography and enabling materials

Fine-tuning CMP slurries for 3D TSV processes

DuPont's Michelle Ho explains the role of CMP in 3D TSV processes and discusses CMP slurry design.

Industry Engagement

Silicon valley technology center hub for collaboration

The Center fosters technology collaboration across DuPont businesses and partners in the Bay Area.

DuPont experts to present at SPIE Advanced Lithography 2020

DuPont will share research as part of the Advances in Patterning Materials and Processes Conference at SPIE Advanced Lithography 2020

DuPont Interconnect Solutions Launches Virtual Expo

As you prepare to take on the next frontier of your industry, partner with DuPont. Let’s tackle tomorrow’s toughest challenges together.

Reddington Addresses Customers at IPC/APEX

Join DuPont at SEMICON Taiwan 2023

Come and meet our experts at SEMICON Taiwan 2023 to discover our range of innovative solutions and experience our diverse and inclusive culture. We can't wait to see you there

Featured Blogs

Autonomous cars drive next-gen PCB material requirements

Silver Plating Technology Driving 200°C Automotive Apps

DuPont Technology Protects Ingenuity Mars Drone Mission

NASA’s Webb Telescope Keeping Cool with Ultra-thin DuPont™ Kapton® Polyimide Films

Fine-tuning CMP slurries for 3D TSV processes

Low-Loss Materials Key for High-Frequency Applications

Flexible Laminate Solutions Target Flexible-Circuit Challenges

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and solve the challenges of our time.