Riston® DI6100M Dry Film Photoresist

Riston® DI6100M Dry Film Photoresist

Fine line direct imaging photoresist solution for HDI mSAP application

Advantages:

• Excellent fine line adhesion and resolution for mSAP pitch 40µm design 
• Superior conformation offering solutions to improve short related defect for high yield productivity 
• Fast photo speed for high exposure process throughput
  (i-line and h-line multiple wavelength DI equipment) 

Applications:

• Advanced dry film photoresist for HDI/SLP (Substrate-like PCB) process