BENEFITS
- Improved Voc from minimized surface recombination without trade-off in fill factor (FF) at lower firing temperatures
- Improved open circuit voltage (Voc) from minimized paste induced rear passivation damage
- Better short circuit current (Jsc) from improved fine line capability
- Good back surface field (BSF) formation on localized contact
- Provides proven module reliability
- Demonstrated strong adhesion to passivation layers
- Minimized Kirkendall voids
- Reliable module performance after climate chamber test
- Non fire-through capability
- High adhesion with low consumption
- Co-fireable with Solamet® front side silver and back side aluminum
- Very good local BSF formation with minimum voiding
- High adhesion on passivation layer (SiO2/SiNx, Al2O3/SiNx stacks) with no dielectric damage
- Fast drying and firing
- Low electrical resistivity after firing
- Cadmium free*