BENEFITS
- Fine-line printability (for gridlines with screen printing)
- Fire-through passivation layer
- Better contact on B-doped emitter layer, enabling a broader diffusion process window
- Low gridline resistivity (high conductivity)
- Flexibility in metallization process selection. Proven technology on double-print design
- Co-fireable with rear side contacts
- Good solderability and adhesion
- Cadmium free*
*Cadmium ‘free’ as used herein means that cadmium is not an intentional ingredient in and is not