DuPont’s photoresist removal and TSV cleaning formulations, part of our EKC Technology portfolio, are optimized to effectively remove thick and thin resists used for through-silicon via (TSV) masks and wafer bumping by solder electroplating or stencil printing. TSV masks and TSV cleaners are designed to effectively remove residues after TSV etch.
EKC162™ Resist Remover
EKC162™ is a formulation optimized to effectively remove thick and thin photo resists used for TSV masks and wafer bumping by solder electroplating or stencil printing with superior bath life and wafer capacity. The product is designed for use in spray processing equipment and wet benches and is capable of removing resist faster and at a lower temperature than the competition.
EKC175™ Resist Remover
EKC175™ completely and efficiently removes tough post-etch residues formed from DRIE TSV processes, enabling a defect-free via filling process.
EKC830™ Resist Remover
EKC830™ is ideal for the effective removal of DuPont MX5000 Series Dry Film where Al is present. This product can be used in spray processing equipment and wet benches.
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