CMP Pads

Optivision™ CMP Polishing Pads

 
 
 

The Optivision™ pad series for chemical mechanical planarization (CMP) is DuPont’s second generation soft pad that improves on the performance of Politex™ pads and is designed for improvements in cost of ownership.

  • Benefits:

    • Improved removal rate and defectivity compared to Politex™ polishing pads
    • Available on multiple substrates
    • Improved lifetime compared to Politex™

    Applications:

    • Copper barrier, Buff, Polysilicon

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