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Pyralux® TK Copper-Clad Laminate

Pyralux® TK Copper-Clad Laminate

DuPont™ Pyralux® TK is a double-sided copper-clad laminate featuring a proprietary layered dielectric, featuring Kapton® polyimide and fluoropolymer films. This unique composition affords the lowest loss performance for a Pyralux® copper-clad laminate, enabling remarkable signal integrity in high speed digital and high frequency circuit applications. Offered with both rolled annealed (RA) and electrodeposited (ED) copper foil, Pyralux® TK can address your highest performance flex and rigid-flex applications where dielectric constant must fall below 3.0

Special Warnings
  • Should be stored in original packaging at temperatures of 4 - 29 °C (40 - 85 °F) and below 70% relative humidity. The product should not be frozen and should be kept dry, clean, and well-protected.
Recommendations
  • Prior to handling, DuPont recommends referencing the Pyralux® Safe Handling Guide available at pyralux.dupont.com.
 
 
 

Features & benefits

  • Balanced and unbalanced constructions available
  • DuPont™ Pyralux® TK double-side clads will shrink more than typical Pyralux® clads after etching, baking, and lamination.
  • Fluoropolymer film provides low-loss dielectric constant loss tangent
  • Low moisture absorption for consistent performance
  • RoHS Compliant
  • The fluoropolymer in Pyralux® TK is chemically similar to the PTFE fluoropolymer utilized in rigid high speed laminates and standard procedures to drill and activate such boards should be applicable.
  • UL 94 VTM-0, UL File E124294
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    Physical Properties

    Property Method Unit Value
    Coefficient of Thermal Expansion XY-Axis IPC-TM-650 2.4.41 ppm/°C 27
    Tensile Strength (prlx-31) IPC-TM-650 2.4.19 MPa > 175
    IPC-TM-650 2.4.19 GPa > 3.2
    Peel Strength (Adhesion to Copper) As Received, After Solder IPC-TM-650 2.4.9 N/mm (lb/in) N/mm (lb/in) N/mm (lb/in) 1.2 (7.0) 1.2 (7.0) 0.2 (7.0)
    Elongation (prlx-15) IPC-TM-650 2.4.19 % 60
    Loss Tangent (Df) ASTM D2520 10 GHz 0.002
    Dimensional Stability (MD/TD) After Etching, After Thermal (150 °C for 30 min) IPC-TM-650 2.2.4 % ± 0.05 / 0.07 % ± 0.07 / 0.13 %
    Decomposition Temperature (2% / 5%) DuPont Method, TMA °C 531 / 548
    Moisture Absorption (prlx-23) IPC-TM-650 2.6.2 % 0.6
    Solder Float, 288 °C for 10 s IPC-TM-650 2.4.13 — Pass
    Dielectric Strength (prlx-11) ASTM D149 V/µm 200
    Dielectric Constant (Dk) ASTM D2520 IPC-TM-650 2.5.5.5 10 GHz 10 GHz 2.5 2.8
    Flexural Endurance, cycles JIS C6471 (MIT) — > 700
     
     
     
    Product Details

    Fabric/material

    TK CLAD

    Design

    TK1810018R

    Seam

    TK CLADS

    Packaging

    TK1810018R

    Hazard

    Coated Material

    TK CLAD

    Features

    SHEET CLADS
     
     
     
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