Ultra Fast Photospeed Direct Imaging Resist

DuPont began formulating specialized photoresists for Laser Direct Imaging (LDI) over 20 years ago, and continues to lead the industry with its Riston® LaserSeries films.

Ultra fast photospeed, high performance, and compatibility with conventional printed wiring board (PWB) processes are critical to help PWB fabricators optimize their LDI equipment investments.

Riston® Laser Series Dry Film Photoresists Include:

Riston® LDI300

• For specialty outerlayer plating applications on 355nm direct imaging equipment
• Exposure productivity and plating latitude enhance throughput and yields

Riston® LDI500

• High productivity film is fully aqueous
• Possesses ultra-fast photospeed
• Compatible with both acid and alkaline etching

Riston® LDI7000

• Customized for tent and etch processes with 355nm direct imaging equipment
• Excellent tenting strength, resolution and adhesion
• Fast stripping that contributes to higher yield and productivity

Riston® LDI7200

• Designed to provide superior performance on LDI imaged outerlayer boards
• Broad range of plating solutions (copper, tin, solder, nickel and gold)
• Available in thicknesses ranging from 40 microns to 100 microns
• Gives fabricator one film to meet all of their imaging needs

Riston® LDI 8000

• Developed for 405 nm LDI equipment
• Fast photospeed (13mJ/cm2~)
• Excellent resolution with wide exposure latitude
• Good conformity
• Vivid printout image
• Strong tenting with excellent hold time stability