DuPont offers organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces through our EKC Technology portfolio.
EKC800™
EKC800™ is designed to remove positive photoresist that has experienced standard processing with normal thermal history.
EKC830™
EKC830™ is designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove.
EKC865™
EKC865™ is specifically formulated to prevent attack of sensitive metals. It will remove positive photoresist with normal thermal history.
EKC922™
EKC922™ is used to remove photoresist over cured or semi-cured polyimide without attack.
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