DuPont’s post-etch residue removers for copper (Cu) applications include CuSolve™ copper integration technology and SAC™ semi-aqueous chemistry removers.
CuSolve™ products are copper compatible cleaning products formulated specifically for advanced designs integrating copper. These products remove photoresist and copper containing residues in the presence of exposed copper and low-k materials.
EKC® 6850 PERR
EKC® 6850 is a Copper Post-Etch Residue Remover formulation optimized for PR Mask, and is Al/Cu compatible.
EKC® 570 PERR
EKC® 652 SAC™ is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.
EKC® 580 PERR
EKC® 580 is a Copper Post-Etch Residue Remover formulation optimized for Metal Hard Mask (MHM) with TiN Etch tuning and is manufacturing proven.
EKC® 590 and EKC® 590S
EKC® 590 and 590S are Copper Post-Etch Residue Remover formulations optimized for Metal Hard Mask (MHM) with TiN and AlN etch tuning and with Co liner compatibility.
The SAC™ (semi-aqueous chemistry) series of products comprise the industry’s most effective solution to the cleaning of etch residue at or below critical dimensions of 0.25µm. Used at ambient temperature for short process times, SAC™ products eliminate W plug failures and facilitate advanced interconnect by complete cleaning of both subtractive etch and damascene structures.
EKC® 652 SAC™
EKC® 652 SAC™ is a semi-aqueous formulation that removes post-etch residue quickly and effectively from substrates containing traditional integration materials.
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