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MEGUM™ rubber-to-substrate bonding

MEGUM™ rubber-to-substrate adhesives are used to bond a variety of elastomer compounds to metal and plastic substrates including steel, stainless steel, aluminum, zinc, copper, polyamides, polyacetals, polyesters, and PTFE.

Most formulations are low-viscosity, organic, solvent-based solutions and/or dispersion of polymers and other reactive chemicals. Water-based and MIBK-free formulations are also available.

Advantages

For curing systems icon

For curing systems

Suitable for all common curing systems, especially fast-curing natural rubbers and rubber blends

High resistance icon

High resistance

To heat, salt, fog, oil, water immersion, corrosion, and hydrolysis

Enables NVH management icon

Enables NVH management

For better acoustics

Formulation advantages icon

Formulation advantages

Free of reportable levels of lead (or other heavy metals), chlorinated solvents, or ozone-depleting chemicals

Markets

Automotive

Case studies and related content

Resources

Water-based adhesive from DuPont enables first-to-market success for bonded rollers

Sustainable solutions for NVH challenges

MEGUM^™/THIXON^™ rubber-to-substrate bonding agents. Product selector guide

MEGUM^™/THIXON^™ rubber-to-substrate bonding agents. Product selector guide—North America

Rubber-to-metal bonding agents technical guide. Bonding performance

Rubber-to-substrate bonding technical guide. Substrate preparation

Rubber-to-substrate bonding agents technical guide. General use of specialty adhesives

Rubber-to-substrate bonding agents technical guide. General use of specialty adhesives, water-borne bonding agents

Rubber-to-substrate bonding agents technical guide. Substrate preparation: Water-borne bonding agents

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